PPM Associates

About Us

Areas of Expertise

     Semiconductor Packaging

    3D and 2.5D Stacked Packaging

     Wafer Level Packaging

     Through Silicon Vias

     Multichip Modules

     HDI/PCB Assembly and Fabrication

Company History

1989: PPM Associates is founded following the successful sale of AWI to SCI, at that time the world's largest EMS company.  Phil Marcoux was the co-founder and CEO of AWI.

1990: Co-Chair of the MCM (Multi-Chip Modules Standards Committee, MC-790

1991: Co-Founder and CEO of ChipScale, Inc., an early WLP (Wafer Level IC Packaging) manufacturer

1992: Awarded the IPC Presidents Award

2003: Appointed Executive Director of MEPTEC (the Micro-Electronics Packaging and Test Engineering Council)

2007: Phil Marcoux is named the "Father of SMT" (Surface Mount Technology) in the US by the IPC.

2011: Consultant to several companies exploring and implementing 2.5D, 3D, TSV, and stacked IC assembly businesses.

Management Team

  • Phil Marcoux, Managing Director
    • Past CEO of ChipScale and AWI, Inc.
    • Former VP of OSE-USA and Tru-Si, Inc.
    • Associate Professor, Gradute School of Engineering, University of Santa Clara
    • Text Author and International Lecturer
  • Plus a team of very knowledgeable and experienced semiconductor bu siness, intellectual property, and packaging expert s.
PPM Associates
Mountain View, CA US
"In the Heart of Silicon Valley"

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